Barriers for Copper Interconnections

O Copper On - Chip Interconnections A Breakthrough in Electrodeposition to Make Better Chips

The Electrochemical Society Interface • Spring 1999 FIG. 1. Cross section of a 6-level copper wiring structure fabricated by IBM showing wiring hierarchy. n-chip interconnections comprise a multilevel structure of fine wiring located on the top of the transistor circuitry of logic or memory chips, whose role is to connect circuits together as shown in Fig. 1. To avoid significant degradation of...

All-copper Chip-to-substrate Interconnections for Flip-chip Packages

Silicides and Local Interconnections for High

As the minimum VLSl feature size continues to scale down to the 0.1-0.2-pm regime, the need for low-resistance local interconnections will become increasingly critical. Although reduction in the MOSFET channel length will remain the dominant factor in achieving higher circuit performance, existing local interconnection materials will impose greater than acceptable performance limitations. We re...

Dense Two-dimensional Integration of Optoelectronics and Electronics for Interconnections

Optics has many features, beyond those already exploited in long-distance fiber communications, that make it interesting for interconnections at short distance, including dense optical interconnections directly to silicon integrated circuit chips. Hybrid technologies, such as solder-bump bonding, have recently been successfully used to attach two-dimensional arrays of optical detectors, emitter...

"Pulling the plug" on cellular copper: the role of mitochondria in copper export.

Mitochondria contain two enzymes, Cu,Zn superoxide dismutase (Sod1) and cytochrome c oxidase (CcO), that require copper as a cofactor for their biological activity. The copper used for their metallation originates from a conserved, bioactive pool contained within the mitochondrial matrix, the size of which changes in response to either genetic or pharmacological manipulation of cellular copper ...